Tool for real-time thermal simulation of printed circuit boards

PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool's easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

Useful applications of PICLS

  • Troubleshooting thermal issues of current products
  • Examining thermal interferences of part layouts
  • Consider heat release changes depending on a wiring pattern (coverage ratio)Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the performance of a heat sink
  • Examine the size of a PCB
  • Examine the number of layers and the thickness of copper foil
  • Consider natural/forced air cooling
  • Consider radiant heat
  • Considering heatsinks (number of fins, size
  • Examining heat dissipation performances by connection to enclosure
  • Considering PCB mounting environment
  • Software Features

    External file interface

    You can import IDF 3.0 and Gerber data

    Consideration of simple enclosures

    You can consider heat dissipation by connection to enclosures


    You can allocate and display parts such as plate fins and heat dissipation plates


    You can register and reuse created parts to the library

    Cutting out a PCB

    Create a PCB of arbitrary shape by cutting out


    Check the layout of components in 3D

    Setting wiring pattern coverage ratio

    Specify the area by rectangle and polygon

    Placing thermal vias

    Specify through hole and IVH
    Specify filled via

    Setting mounting environment

    Mount horizontally/vertically
    Consider forced air cooling and radiation

    Displaying each layer

    Check each layer by selecting a focused layer

    Real-time display

    Check component translation in real time

    Report output

    Output analysis results as reports

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