PICLS

Tool for real-time thermal simulation of printed circuit boards

PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool's easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

Useful applications of PICLS

Troubleshooting thermal issues of current products

Examining thermal interferences of part layouts

Consider heat release changes depending on a wiring pattern (coverage ratio)Examine the arrangement of thermal vias (e.g. location, number)

Examine the arrangement of thermal vias (e.g. location, number)

Examine the performance of a heat sink

Examine the size of a PCB

Examine the number of layers and the thickness of copper foil

Consider natural/forced air cooling

Consider radiant heat

Considering heatsinks (number of fins, size

Examining heat dissipation performances by connection to enclosure

Considering PCB mounting environment

Software Features

External file interface

You can import IDF 3.0 and Gerber data

Consideration of simple enclosures

You can consider heat dissipation by connection to enclosures

Heatsink

You can allocate and display parts such as plate fins and heat dissipation plates

Library

You can register and reuse created parts to the library

Cutting out a PCB

Create a PCB of arbitrary shape by cutting out

Preview

Check the layout of components in 3D

Setting wiring pattern coverage ratio

Specify the area by rectangle and polygon

Placing thermal vias

Specify through hole and IVH
Specify filled via

Setting mounting environment

Mount horizontally/vertically
Consider forced air cooling and radiation

Displaying each layer

Check each layer by selecting a focused layer

Real-time display

Check component translation in real time

Report output

Output analysis results as reports